April 12 -- Virtual CEO Summit on Semiconductor and Supply Chain Resilience -- President's remarks
https://www.whitehouse.gov/briefing-room/speeches-remarks/2021/04/12/remarks-by-president-biden-at-a-virtual-ceo-summit-on-semiconductor-and-supply-chain-resilience/
Readout
https://www.whitehouse.gov/briefing-room/statements-releases/2021/04/12/readout-of-white-house-ceo-summit-on-semiconductor-and-supply-chain-resilience/
March 30 -- BIS announces a virtual forum on April 8, 2021 (2-5 PM) that will allow commenters to address the policy objectives listed in E.O. 14017 as they affect the U.S. semiconductor manufacturing and advanced packaging supply chains including, but not limited to, the elements included in the March 15 notice.
Virtual forum registration and request to speak:
https://www.bis.doc.gov/semiconductorforum
FRN:
https://www.federalregister.gov/documents/2021/03/30/2021-06579/virtual-forum-for-risks-in-the-semiconductor-manufacturing-and-advanced-packaging-supply-chain
March 15 -- On February 24, 2021, President Biden issued an Executive order on “America's Supply Chains,” which directs several Federal agency actions to secure and strengthen America's supply chains. One of these directions is for the Secretary of Commerce (the Secretary) to submit, within 100 days, a report to the President identifying risks in the semiconductor manufacturing and advanced packaging supply chains, and proposing policy recommendations to address these risks. This notice requests comments and information from the public to assist the Department of Commerce (Commerce) in preparing the report required by the Executive order.
Additionally, the National Defense Authorization Act of 2021 (FY21 NDAA) includes a title for “Creating Helpful Incentives to Produce Semiconductors for America” that mandates several Federal actions in securing the semiconductor-related supply chain. One of these requirements is for the Secretary to assess the capabilities of the U.S. microelectronics industrial base to support the national defense, in light of the global nature and interdependence of the supply chain with respect to manufacture, design, and end use. After the report required by the Executive order is completed, Commerce will assess whether additional information will be needed to conduct the assessment required by the FY21 NDAA.
The Department is particularly interested in comments and information directed to the policy objectives listed in E.O. 14017 as they affect the U.S. semiconductor manufacturing and advanced packaging supply chains, including but not limited to the following elements: . . . (eight comment areas)
Commerce RFI:
https://www.federalregister.gov/documents/2021/03/15/2021-05353/risks-in-the-semiconductor-manufacturing-and-advanced-packaging-supply-chain
E.O. 14017:
https://www.federalregister.gov/documents/2021/03/01/2021-04280/americas-supply-chains
FY2021 NDAA Title XCIX Creating Helpful Incentives to Produce Semiconductors for America:
https://www.dropbox.com/s/u0aey31zccv8fd6/FY21%20NDAA%20semiconductors%20Title%2099.pdf?dl=0
